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Contracts worth $17.5 million are from existing customers in the semiconductor industry.
May 16, 2018
By: DAVID SAVASTANO
Editor, Ink World Magazine
Meyer Burger Technology Ltd announced the successful conclusion of repeat orders from two existing customers for its DS 261 wire saw equipment for slicing and wafering applications in the semiconductor industry. In response to the strong growing global demand for semi-wafers, the customers, global manufacturers in the semiconductor industry, are expanding their production capacity. The strategic selection of Meyer Burger’s DS 261 cutting equipment is based on their excellent experience with ...
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